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DA1634.001 28 November, 2008
MAS1634
Quad LED Driver IC
* * * * Quad Current Sink Output Wide Supply Voltage Range Low Power Consumption Power Down Control
DESCRIPTION
MAS1634 is a quad LED driver IC. It has four constant current sink type outputs for driving up to four LEDs. It has wide supply voltage range and low power consumption ideally suitable for low power applications. MAS1634 can be set into power down mode by a power down control pin. The LED driver control inputs have pull down resistors and which are disabled in the power down mode.
FEATURES
* * * * Quad Current Sink Output, 2.1 mA typ Wide Supply Voltage Range from 1.0 V to 3.1 V Low Power Consumption Power Down Control
APPLICATIONS
* * LED Driver for Portable Low Power Application IR LED Driver for Optical Hand Position Detection of Radio Controlled Watch
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DA1634.001 28 November, 2008
BLOCK DIAGRAM
VDD1 XPD & IN1
VDD2 DUMMY
OUT1
IN2
OUT2
IN3
OUT3
IN4
OUT4
MAS1634
4 x LED Driver
GND1 GND2
Figure 1. MAS1634 Block Diagram Figure 1 presents MAS1634 block diagram. MAS1634 consists of four fixed current sink outputs for driving VDD connected LEDs. Each LED driver can be turned on or off independently. There is also common power-down control pin XPD which is active when low. The dummy pad is electrically unconnected and its only purpose is to make the pad layout symmetrical which helps in making the flip-chip connection even more reliable. VDD1 and VDD2 power supply pins are internally connected making only one supply voltage connection necessary. Also GND1 and GND2 pins are internally connected so that it is necessary to connect only one of the two ground pins to supply ground.
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DA1634.001 28 November, 2008
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Storage Temperature Input Voltage Latch-up Current Limit Symbol VDD TST VIN ILUT Conditions Min -0.3 -55 -0.3 -100 Max 6.0 +125 VDD+0.3 100 Unit V C V mA
o
For all pins (see note 1)
Stresses beyond those listed may cause permanent damage to the device. The device may not operate under these conditions, but it will not be destroyed. This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages (ESD). Note 1. In latch-up testing the supply voltages are connected normally to the tested device. Then pulsed test current is fed to each input separately and device current consumption is observed. If the device current consumption increases suddenly due to test current pulses and the abnormally high current consumption continues after test current pulses are cut off then the device has gone to latch up. Current pulse is turned on for 10 ms and off for 20 ms. Testing is done up to 300 mA.
ELECTRICAL CHARACTERISTICS
(Operating Conditions: VDD = 2.0V, Temperature = 25 unless otherwise mentioned) C
Parameter Supply Voltage Operating Temperature Standby Current Quiescent Current
Symbol VDD TA ISS ISC
Conditions
Min 1.0 -20
Typ 2.0 +25
Max 3.1 +60 0.5 0.5 300 500 700 900 4.5 4.0 3.45 3 3 100 VDD 0.2*VDD 50
Unit V C A A
Current driver
ICD
Leakage current of an output Input high voltage Input low voltage Start up time
Ileak VIH VIL tst
XPD = "0" XPD = "1", OUTPUTS OFF (INx="0") XPD = "1", 1 OUTPUT ON XPD = "1", 2 OUTPUTS ON XPD = "1", 3 OUTPUTS ON XPD = "1", 4 OUTPUTS ON XPD = "1" VDD = 0.95V, OUT1-4 = 0.075V VDD = 1.15V, OUT1-4 = 0.025V VDD = 1.15V, OUT1-4 = 0.075V VDD = 1.25V, OUT1-4 = 0.175V VDD = 1.70V, OUT1-4 = 0.625V VDD = 1.70 V, VOUT1-4 = VDD VIN1-4 = GND
140 270 390 500 1.4 1 1.4 1.4 1.4 2.1 1.8 2.1 2.1 2.1
mA
nA V V s
0.8*VDD GND VDD = 1.15 V 15
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DA1634.001 28 November, 2008
FUNCTIONAL DESCRIPTION
N Main Functions MAS1634 has two functional blocks. First is the LED driver to drive LEDs in a wrist watch applications. Second is Bias voltage generator for generating bias current for the drivers N Inverting input buffer The inverting buffers buffer the input signals. These blocks also contain pull-down resistors and they are switched in an inactive high impedance state if the XPD input is low. If the XPD pin is high then the INx inputs have pull down by the pull down resistors. Nominally the values of the pull down resistors are 1.7 M but they can vary 15%. The XPD input doesn't have pull down resistor so this input must be driven by the controller or be connected to VDD (always ON mode) in order to achieve properly controlled operation. N Output Driver Four switchable low-voltage 2.1 mA constant current sinks with very low drop-out voltage are implemented to drive external VDD connected LEDs. N Bias Generator Bias voltage generator supplies bias current for the output drivers. It is turned on if XPD is high and if any of the four control inputs is high.
N Operating Modes
MAS1634 has two operating modes. These modes are simply ON and OFF modes. ON mode is selected when XPD is high. In ON mode each of the four output drivers can be switched on separately by setting each of the INx control inputs high. If control input is low the corresponding current output driver is off. If all control inputs are low the bias generator is turned off. OFF mode is selected when XPD is low. In OFF mode the bias generator and the current drivers are in power down. The device has two supply voltage pins VDD1 and VDD2 and which are internally connected. It is sufficient to connect only one of the two supply pins but if both supplies are connected then they should be connected to same voltage potential. The device has also two supply ground pins GND1 and GND2 and which are internally connected. It is sufficient to connect only one of the two ground pins but if both grounds are connected then they should be connected to same ground potential.
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DA1634.001 28 November, 2008
MAS1634 PAD LAYOUT
1580 m (X-scribe line width 100 m) VDD1 XPD IN1 IN2 IN3 IN4 VDD2 MAS1634 GND1 DUMMY OUT1 OUT2 OUT3 OUT4 GND2
DIE size = 1.58 mm x 1.66 mm; PAD size = 90 m x 90 m Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left floating. Please make sure that GND1 and GND2 are the first pads to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area.
MAS1634 PAD COORDINATES
Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die. Pad Identification Positive Power Supply Power Down Input LED Current Driver Input 1 LED Current Driver Input 2 LED Current Driver Input 3 LED Current Driver Input 4 Positive Power Supply Power Supply Ground Unused Dummy Pad LED Current Driver Output 1 LED Current Driver Output 2 LED Current Driver Output 3 LED Current Driver Output 4 Power Supply Ground Name VDD1 XPD IN1 IN2 IN3 IN4 VDD2 GND1 DUMMY OUT1 OUT2 OUT3 OUT4 GND2 X-coordinate 158 m 158 m 158 m 158 m 158 m 158 m 158 m 1422 m 1422 m 1422 m 1422 m 1422 m 1422 m 1422 m Y-coordinate 1435 m 1225 m 1014 m 814 m 603 m 392 m 182 m 1435 m 1225 m 1014 m 814 m 603 m 392 m 182 m Note 1 3 4 4 4 4 1 2 5
1660 m (Y-scribe line width 210 m)
2
Notes: 1) Keep VDD1 and VDD2 in same potential since both are internally connected together. Due to internal connection it is only necessary to connect at least one of the two VDD pins to supply voltage. 2) Keep GND1 and GND2 in same potential since both are internally connected together. Due to internal connection it is only necessary to connect at least one of the two GND pins to supply ground. 3) Power down mode when XPD is low and operating mode when XPD is high. 4) Each led driver input has 1.7M 15% pull-down resistor but which are in an inactive high impedance state if the XPD input is low (i.e. power down mode). This is the reason why XPD pin requires external control to achieve properly controlled operation. 5) Dummy pad is electrically unconnected and its only purpose is to make pad layout symmetrical.
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DA1634.001 28 November, 2008
TYPICAL APPLICATION
VDD
VDD1 VDD2
VDD
XPD & IN1
DUMMY OUT1
VDD
VDD
IN2 OUT2
MCU
IN3 OUT3
VDD
VDD
IN4 OUT4
MAS1634
GND1
4 x LED Driver
GND2
GND
Figure 2. Application circuit of MAS1634 quad LED driver
GND
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DA1634.001 28 November, 2008
MAS1634 SAMPLES IN DIL-20 PACKAGE
1 2 VDD1 3 XPD 4 IN1 5 IN2 6 IN3 7 IN4 8 VDD2 9 10
MAS1634xx YYWW XXXXX.X
20 19 GND1 18 17 OUT1 16 OUT2 15 OUT3 14 OUT4 13 GND2 12 11 Top Marking Definitions: YYWW = Year Week XXXXX.X = Lot Number xx = Sample Version
PIN DESCRIPTION
Pin Name Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Type NC NC P DI DI DI DI DI P NC NC NC G AO AO AO AO NC G NC Function Note
VDD1 XPD IN1 IN2 IN3 IN4 VDD2
Positive Power Supply Power Down Input LED Current Driver Input 1 LED Current Driver Input 2 LED Current Driver Input 3 LED Current Driver Input 4 Positive Power Supply
1 3 4 4 4 4 1
GND2 OUT4 OUT3 OUT2 OUT1 GND1
Power Supply Ground LED Current Driver Output 4 LED Current Driver Output 3 LED Current Driver Output 2 LED Current Driver Output 1 Power Supply Ground
2
2
A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected
Notes: 1) Keep VDD1 and VDD2 in same potential since both are internally connected together. Due to internal connection it is only necessary to connect at least one of the two VDD pins to supply voltage. 2) Keep GND1 and GND2 in same potential since both are internally connected together. Due to internal connection it is only necessary to connect at least one of the two GND pins to supply ground. 3) Power down mode when XPD is low and operating mode when XPD is high. 4) Each led driver input has 1.7M 15% pull-down resistor but which are in an inactive high impedance state if the XPD input is low (i.e. power down mode). This is the reason why XPD pin requires external control to achieve properly controlled operation.
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DA1634.001 28 November, 2008
ORDERING INFORMATION
Product Code MAS1634AA1WA611 Product Quad LED Driver IC Description EWS-tested 300 m thick MAS1634 wafer
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com
NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.
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